Product Name | Silicon Ring |
---|---|
Material | Single Crystal Silicon |
Multi Crystal Silicon |
|
Purity(%) | Single Crystal Silicon ( 8N 99.999999% ) |
Multi Crystal Silicon ( 5N 99.999%) |
|
Applications | Dry etcher process |
Out Dia | 520mm ( max ) |
Thickness (Flatness) | 1~70mm ( <15㎛ ) |
Res. ( Ω.㎝ ) | Low: < 0.02 Middle : 1~5 High 60~90 |
Surface Condition | Polishing |
Lapping |
|
Grinding |
|
Quality ( Visual ) | Chipping |
Scratch |
|
Crack |
|
Stain Free |
|
Quality ( Cleaning Process ) | 100 ppb or less per element ( Na, Mg, Al, K, Ca, Cr, Fe, Ni, Cu, Zn, and Y ) |
By ensuring the processing capability is in the best quality condition and has appropriate etching, damage to the product surface is removed.
Product Name | Silicon SHOWER HEAD |
---|---|
Material | Single Crystal Silicon |
Purity(%) | Single Crystal Silicon ( 8N 99.999999% ) |
Applications | Dry etcher process |
Out Dia | 440mm ( max ) |
Thickness (Flatness) | 1 ~ 15mm ( <15㎛ ) |
Res. ( Ω.㎝ ) | Low: < 0.02 Middle : 1~5 High 60~90 |
Gas Hole | Diameter 0.3~1.0mm |
Roundness < 0.05mm |
|
Concentricity < 0.05mm |
|
Δ XY-Position < 0.05mm |
|
Surface Condition | Polishing |
Lapping |
|
Grinding |
|
Quality ( Visual ) | Chipping |
Scratch |
|
Crack |
|
Stain Free |
|
Quality ( Cleaning Process ) | 100 ppb or less per element ( Na, Mg, Al, K, Ca, Cr, Fe, Ni, Cu, Zn, and Y ) |
The quality inside holes is guaranteed through the use ofan appropriate processing method.
Any damage generated inside holes is removed through an appropriate processing method and proper etching.